Generic package illustration: TSOP2(50),BGA(60) — AI-generated FBGA / TFBGA package-family top-view illustration, not a photograph of this model. The underside solder-ball layout is not shown. Dimensions and pin layout must be checked in manufacturer documentation. Illustrated package option: TSOP2(50),BGA(60).

Manufacturer Specifications

Density (Mb; organization × width)	16
Organization	1Mx16
Supply voltage	3.3V
Memory type	SDR
Available package options	TSOP2(50),BGA(60)
Speed (manufacturer selector notation)	200,166,143
Refresh (manufacturer selector notation)	2K

Parameters are sourced from manufacturer documentation. Availability and current status require confirmation. Compatibility with a particular UAV is not established.

Parameter source · Datasheet

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Pre-order validation

Confirm the complete ordering code and package option. Listed parameters do not establish drop-in equivalence or compatibility with your board. Validate supply, pinout, thermal limits, interface and firmware support. Current stock has not been verified.

Source retrieved: 2026-10-11. SHA-256: c14b29e954918e58e7ccc38a5686697a27a99b0cf827dcc028eada755570a7b6

Manufacturer source

IS42S16100H

Manufacturer Specifications

Pre-order validation