Generic package illustration: SOIC (D)
AI-generated cropped package-family illustration; not a photograph of this model. The complete package and pin layout are not shown. Consult manufacturer documentation. Illustrated package option: SOIC (D).

Manufacturer Specifications

Vin (max) (V)16.5
Vin (min) (V)0.8
Number of channels1
Imax (A)250
Iq (typ) (mA)1.2
Iq (max) (mA)7
IGate source (typ) (µA)292
IGate source (max) (µA)350
IGate sink (typ) (mA)5
IGate pulsed (typ) (A)2.35
Operating temperature range (°C)-40 to 85
VGS (max) (V)11.5
Package / pins / body dimensionsSOIC (D) / 8 / 29.4 mm² (4.9 mm × 6 mm); TSSOP (PW) / 8 / 19.2 mm² (3 mm × 6.4 mm)

Parameters are sourced from manufacturer documentation. Availability and current status require confirmation. Compatibility with a particular UAV is not established.

Parameter source

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