Generic package illustration: SOIC (DFF)
AI-generated cropped package-family illustration; not a photograph of this model. The complete package and pin layout are not shown. Consult manufacturer documentation. Illustrated package option: SOIC (DFF).

Manufacturer Specifications

Withstand isolation voltage (VISO) (Vrms)3750
Number of channels1
Forward voltage (typ) (V)1.5
Forward current (IF) (max) (mA)20
Forward current (IF) (min) (µA)2000
Data rate (max) (Mbps)25
Operating temperature range (°C)-40 to 125
CMTI (min) (kV/µs)125
Creepage (min) (mm)5
Clearance (min) (mm)5
Package / pins / body dimensionsSOIC (DFF) / 5 / 24.57 mm² (3.51 mm × 7 mm)

Parameters are sourced from manufacturer documentation. Availability and current status require confirmation. Compatibility with a particular UAV is not established.

Parameter source

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