Generic package illustration: SOIC (DFG)
AI-generated cropped package-family illustration; not a photograph of this model. The complete package and pin layout are not shown. Consult manufacturer documentation. Illustrated package option: SOIC (DFG).

Manufacturer Specifications

Withstand isolation voltage (VISO) (Vrms)3750, 5000
Number of channels1
Current transfer ratio (CTR) (min) (%)375
Current transfer ratio (CTR) (max) (%)560
Forward voltage (typ) (V)1.2
Forward current (IF) (max) (mA)50
Forward current (IF) (min) (µA)500, 500
Data rate (max) (Mbps)0.1
Operating temperature range (°C)-55 to 125
Turnon time (enable) (µs)0.44, 0.44
Turnoff time (disable) (µs)2.7, 2.7
Creepage (min) (mm)5, 8
Clearance (min) (mm)5
Package / pins / body dimensionsSOIC (DFG) / 4 / 24.57 mm² (3.51 mm × 7 mm); SOIC (DFH) / 4 / 18.9 mm² (2.7 mm × 7 mm); SOIC (DFS) / 4 / 37.08 mm² (3.6 mm × 10.3 mm)

Parameters are sourced from manufacturer documentation. Availability and current status require confirmation. Compatibility with a particular UAV is not established.

Parameter source

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