Generic package illustration: SOIC (DW)
AI-generated cropped package-family illustration; not a photograph of this model. The complete package and pin layout are not shown. Consult manufacturer documentation. Illustrated package option: SOIC (DW).

Manufacturer Specifications

Number of channels4
Data rate (max) (Mbps)100
SPI frequency (max) (MHz)15.5
Propagation delay time (typ) (ns)10.7
Propagation delay time (max) (ns)16
Part-to-part output skew (max) (ns)4.5
Pulse-width distortion (t(PHL) - t(PLH)) (max) (ns)4.1
Channel-to-channel output skew (max) (ns)2.5
Working isolation voltage (VIOWM) (Vrms)2000
Withstand isolation voltage (VISO) (Vrms)5700
Surge isolation voltage (VIOSM) (kVPK)12.8
CMTI (min) (kV/µs)85
Creepage (min) (mm)8, 14.5
Current consumption per channel (DC) (typ) (mA)1
Current consumption per channel (1 Mbps) (typ) (mA)1.65
Operating temperature range (°C)-55 to 125
Transient isolation voltage (VIOTM) (VPK)8000
Clearance (min) (mm)8, 14.5
Package / pins / body dimensionsSOIC (DW) / 16 / 106.09 mm² (10.3 mm × 10.3 mm); SOIC (DWW) / 16 / 177.675 mm² (10.3 mm × 17.25 mm)

Parameters are sourced from manufacturer documentation. Availability and current status require confirmation. Compatibility with a particular UAV is not established.

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