Specifications
Part NumberDRV8323
ManufacturerTexas Instruments
Device TypeSmart 3-Phase BLDC Gate Driver
Supply Voltage6 V – 60 V
Gate Drive Sink Current1 A (peak)
Gate Drive Source Current2 A (peak)
Current Shunt Amplifiers3 × independent, programmable gain (1x–40x)
Configuration ModesSPI or Hardware (HW) pin-configurable
Integrated Buck Regulator600 mA step-down
Smart Gate DriveAdaptive slew rate control for EMI reduction
PackageQFN-48 (7 × 7mm)
Operating Temperature−40°C to +125°C
Supply Voltage Range (VM)6 V – 60 V
Gate Drive Voltage7 V – 14 V (adjustable)
Peak Gate Drive Current1 A sink / 2 A source (per channel)
Shunt Amplifier Gain Options5, 10, 20, 40 V/V (SPI mode)
Shunt Amplifier Bandwidth200 kHz (Gain=40), 600 kHz (Gain=5)
Buck Converter Output600 mA continuous, 3.3V/5V selectable
VDS Over-Current Threshold0.06 V – 2 V (configurable via SPI)
VSENSE Over-Current Threshold0.25 V (fixed), gain-scalable
Sleep Mode Current< 10 µA
Thermal ProtectionWarning at ~135°C, shutdown at ~170°C
Configuration InterfaceSPI (4-wire, Mode 0/3) or Hardware mode
Gate Drive Inputs6 × PWM (INHx/INLx), independent control
Fault OutputnFAULT pin (open-drain) with SPI fault registers
Gate Drive ModesSmart gate drive or fixed slew rate (SPI selectable)
OCP TypesVDS monitor + VSENSE comparator, cycle-by-cycle
Dead-Time ControlProgrammable via SPI or fixed in HW mode
Shunt Amp Outputs3 × analog (SOA, SOB, SOC) for direct ADC read
1xPWM ModeSingle PWM per half-bridge with automatic handshake
DVDD LDO3.3V / 30 mA output for external logic supply
Part NumberDRV8323
Orderable Qty1 pcs – 10,000+ pcs
Price (1–9 pcs)Contact for quote
Price (10–99 pcs)Contact for quote
Price (100–499 pcs)Contact for quote
Price (500+ pcs)Best pricing available
Lead Time (stock)3–7 business days
PackagingTape & Reel (T&R)
RoHS CompliantYes (Pb-free)

Please confirm exact parameters with manufacturer datasheet.

Product Description

The DRV8323 from Texas Instruments is a next-generation smart 3-phase BLDC gate driver that combines advanced protection features with flexible configuration in a compact QFN-48 (7×7mm) package. Operating from 6V to 60V, it delivers 1A sink and 2A source peak gate drive currents, making it ideal for driving modern low-Rds(on) MOSFETs in Field-Oriented Control (FOC) drone ESC designs. The standout feature is TI's Smart Gate Drive technology, which dynamically adjusts gate drive current to minimize EMI while maintaining efficient MOSFET switching.

Unlike its predecessor DRV8301, the DRV8323 integrates three independent current shunt amplifiers with programmable gains from 5× to 40× (SPI mode) or fixed 20× (HW mode). This triple-shunt architecture enables full three-phase current sensing without current reconstruction — critical for sensorless FOC algorithms that require precise, simultaneous measurement of all three phase currents. The amplifier outputs (SOA, SOB, SOC) connect directly to the MCU ADC, eliminating external op-amps and reducing BOM cost for compact ESC layouts.

The DRV8323 supports dual configuration modes: full SPI register control for maximum flexibility, or hardware (HW) mode via pin strapping for simpler designs. Protection is comprehensive with VDS over-current monitoring on each MOSFET (configurable threshold 0.06–2V) and VSENSE over-current detection via the shunt amplifiers. The integrated 600mA buck regulator with selectable 3.3V or 5V output powers the MCU, while the DVDD LDO provides 3.3V/30mA for external logic. Combined with programmable dead-time and 1× PWM mode (automatic high/low handshake), the DRV8323 minimizes the MCU timer resources required for motor control.

For next-generation drone ESC designs, the DRV8323 is the recommended choice when compact size, low EMI, and sensorless FOC capability are priorities. The QFN-48 package with exposed thermal pad enables miniaturized ESC designs for racing drones and compact multirotors. Smart Gate Drive's adaptive current control significantly reduces radiated EMI — an important consideration for drones carrying sensitive GPS/GNSS receivers and video transmission equipment. The −40°C to +125°C operating range ensures reliable operation in demanding environments.

Key Features

  • Smart Gate Drive technology — adaptive slew rate minimizes EMI without sacrificing efficiency
  • Triple independent shunt amplifiers — full 3-phase current sensing for sensorless FOC
  • Dual configuration modes — SPI (full control) or HW (pin-strap) for design flexibility
  • VDS + VSENSE over-current protection — dual-layer protection for MOSFET safety
  • 1× PWM mode — automatic high/low handshake reduces MCU timer requirements
  • Integrated 600mA buck + 3.3V DVDD LDO — complete power solution from motor bus
  • Programmable gain (1×–40×) with 5 gain settings — precise current measurement
  • Compact QFN-48 (7×7mm) with thermal pad — ideal for miniaturized drone ESC
Frequently Asked Questions
What is the difference between DRV8323 and DRV8323R?
The DRV8323 and DRV8323R are part of the same family but differ in their SPI register interfaces. The DRV8323 (non-R) uses a standard SPI interface where each register access is a 16-bit frame. The DRV8323R variant uses a slightly different register map optimized for daisy-chain SPI configurations. Both parts share identical electrical specifications, smart gate drive features, and QFN-48 package. The DRV8323 is the more commonly stocked variant and is fully supported by TI's MotorWare SDK. Unless you specifically need daisy-chain SPI capability, the standard DRV8323 is the recommended choice.
How do I implement sensorless FOC using the triple shunt amplifiers?
Connect the three shunt amplifier outputs (SOA, SOB, SOC) directly to three ADC channels on your MCU. Configure the gain via SPI register to match your shunt resistor value — for a 1 mΩ shunt with 40A peak, set gain to 10 V/V (output = 0.4V at 40A). Sample all three phase currents simultaneously at the PWM center-aligned point (zero vector) for clean readings. The DRV8323's VSENSE OCP can be used as a backup protection layer — set the threshold via GAIN_CSAMP to trigger nFAULT if any phase current exceeds the limit. For closed-loop FOC, the triple shunt provides instant current feedback without the reconstruction math required by dual-shunt designs.
What are the Smart Gate Drive advantages and when should I use fixed slew rate instead?
Smart Gate Drive dynamically controls the MOSFET gate current during turn-on and turn-off transitions, adjusting the drive strength to achieve an optimal balance between switching losses and EMI. Benefits include reduced radiated EMI (typically 3–6 dB improvement), lower MOSFET ringing, and automatic adaptation to different MOSFET gate charges. Use Smart Gate Drive for most drone ESC applications, especially those with sensitive onboard GPS or video systems. Switch to fixed slew rate (configurable via SPI) when you need deterministic switching behavior, such as when performing precise dead-time optimization or when using MOSFETs with very specific gate drive requirements specified by the manufacturer.

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UAV Applications
FOC Racing/Performance Drone ESC
Triple shunt + Smart Gate Drive enables high-performance sensorless FOC. Reduced EMI protects onboard GPS and video systems while delivering smooth, efficient motor control for racing and freestyle quads.
Miniaturized ESC for Compact Drones
QFN-48 (7×7mm) package with integrated buck and LDO enables ultra-compact ESC layouts. Ideal for sub-250g drones, cinewhoops, and micro multirotors where PCB real estate is extremely limited.
Sensorless FOC Gimbal Motor Control
Precision triple-shunt current sensing enables smooth, low-speed FOC for camera gimbal motors. Smart Gate Drive reduces EMI that could interfere with video transmission and GPS reception.
Dual-Mode ESC Development Platform
HW mode for rapid prototyping without SPI code; SPI mode for production optimization. 1× PWM mode simplifies MCU timer configuration, freeing resources for other flight-critical tasks.
Similar Products (Power Management IC)
Alternative / Drop-in Parts
Related Components (Used Together)
Sourcing Notes

The DRV8323 is an active production part from Texas Instruments with growing adoption in drone ESC designs. UAVCHIP maintains inventory with 3–7 business day lead time for standard quantities. The QFN-48 package requires proper PCB layout — the exposed thermal pad must connect to a large ground plane through a 5×5 array of thermal vias. For SPI mode operation, ensure a dedicated SPI bus is available on your MCU (the DRV8323 cannot share SPI with other devices due to timing constraints). We also stock the DRV8323R variant for daisy-chain applications. For volume orders exceeding 500 pcs, contact our procurement team for allocation. Complementary components including CSD88584Q5DC NexFET power blocks and precision shunt resistors are available for complete ESC BOM solutions.

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