Generic package illustration: 300mil 16-SOP 6x8mm 24-TFBGA 8x6mm 8-WSON
AI-generated FBGA / TFBGA package-family top-view illustration, not a photograph of this model. The underside solder-ball layout is not shown. Dimensions and pin layout must be checked in manufacturer documentation. Illustrated package option: 300mil 16-SOP 6x8mm 24-TFBGA 8x6mm 8-WSON.

Manufacturer Specifications

Density512Mb
Minimum supply voltage (V)2.7
Maximum supply voltage (V)3.6
Minimum operating temperature (°C)-40
Maximum operating temperature (°C)85
Available package options300mil 16-SOP 6x8mm 24-TFBGA 8x6mm 8-WSON
Read frequency (MHz; bus width)133(x1, x2, x4)

Parameters are sourced from manufacturer documentation. Availability and current status require confirmation. Compatibility with a particular UAV is not established.

Parameter source · Datasheet

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