Generic package illustration: 200mil 8-SOP 6x8mm 24-TFBGA
AI-generated FBGA / TFBGA package-family top-view illustration, not a photograph of this model. The underside solder-ball layout is not shown. Dimensions and pin layout must be checked in manufacturer documentation. Illustrated package option: 200mil 8-SOP 6x8mm 24-TFBGA.

Manufacturer Specifications

Density32Mb
Minimum supply voltage (V)2.7
Maximum supply voltage (V)3.6
Minimum operating temperature (°C)-40
Maximum operating temperature (°C)85
Available package options200mil 8-SOP 6x8mm 24-TFBGA
Read frequency (MHz; bus width)104(x1, x4) 86(x2)

Parameters are sourced from manufacturer documentation. Availability and current status require confirmation. Compatibility with a particular UAV is not established.

Parameter source · Datasheet

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