Generic package illustration: TSOP2(50),BGA(60)
AI-generated FBGA / TFBGA package-family top-view illustration, not a photograph of this model. The underside solder-ball layout is not shown. Dimensions and pin layout must be checked in manufacturer documentation. Illustrated package option: TSOP2(50),BGA(60).

Manufacturer Specifications

Density (Mb; organization × width)16
Organization1Mx16
Supply voltage3.3V
Memory typeSDR
Available package optionsTSOP2(50),BGA(60)
Speed (manufacturer selector notation)166,143
Refresh (manufacturer selector notation)2K

Parameters are sourced from manufacturer documentation. Availability and current status require confirmation. Compatibility with a particular UAV is not established.

Parameter source · Datasheet

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