Generic package illustration: BGA(78)
AI-generated FBGA / TFBGA package-family top-view illustration, not a photograph of this model. The underside solder-ball layout is not shown. Dimensions and pin layout must be checked in manufacturer documentation. Illustrated package option: BGA(78).

Manufacturer Specifications

Density (Mb; organization × width)4096
Organization512Mx8
Supply voltage1.35V
Memory typeDDR3
Available package optionsBGA(78)
Speed (manufacturer selector notation)1600,1333
Refresh (manufacturer selector notation)8K

Parameters are sourced from manufacturer documentation. Availability and current status require confirmation. Compatibility with a particular UAV is not established.

Parameter source · Datasheet

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