Generic package illustration: TSOP2(66),BGA(60)
AI-generated FBGA / TFBGA package-family top-view illustration, not a photograph of this model. The underside solder-ball layout is not shown. Dimensions and pin layout must be checked in manufacturer documentation. Illustrated package option: TSOP2(66),BGA(60).

Manufacturer Specifications

Density (Mb; organization × width)512
Organization32Mx16
Supply voltage2.5V
Memory typeDDR
Available package optionsTSOP2(66),BGA(60)
Speed (manufacturer selector notation)200,166,133
Refresh (manufacturer selector notation)8K

Parameters are sourced from manufacturer documentation. Availability and current status require confirmation. Compatibility with a particular UAV is not established.

Parameter source · Datasheet

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