Generic package illustration: BGA(54)
AI-generated FBGA / TFBGA package-family top-view illustration, not a photograph of this model. The underside solder-ball layout is not shown. Dimensions and pin layout must be checked in manufacturer documentation. Illustrated package option: BGA(54).

Manufacturer Specifications

Density (Mb; organization × width)32
Organization2Mx16
Supply voltage2.5V
Memory typeMSDR
Available package optionsBGA(54)
Refresh (manufacturer selector notation)4K

Parameters are sourced from manufacturer documentation. Availability and current status require confirmation. Compatibility with a particular UAV is not established.

Parameter source · Datasheet

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