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Specifications
Part NumberTHGBMHG8C2LBAIL
ManufacturerKioxia (Toshiba)
TypeeMMC 5.1
Capacity16 GB
Bus Width8-bit
Bus SpeedHS400
PackageBGA-153 (11.5×13mm)
Supply Voltage1.8 V / 2.7–3.6 V
Operating Temp−25°C to +85°C
RoHSYes
VCCQ1.8 V
VCC2.7–3.6 V
Seq Read300 MB/s
Seq Write150 MB/s
IOPS Read8000
IOPS Write5000
eMMCJEDEC 5.1 HS400
CMD busSingle CMD wire
Boot partition2× 4MB
RPMB1× 512KB
Part NumberTHGBMHG8C2LBAIL
Orderable Qty1 pcs – 10,000+ pcs
Price (1–9 pcs)Contact for quote
Price (10–99 pcs)Contact for quote
Price (100–499 pcs)Contact for quote
Price (500+ pcs)Best pricing available
Lead Time (stock)3–7 business days
PackagingTray / Tape & Reel (T&R)
Export ControlEAR99 (No license required)
Product Description

The THGBMHG8C2LBAIL is a 16GB eMMC 5.1 · BGA-153 · Kioxia from Toshiba/Kioxia, widely used in UAV and drone applications.

This component is a popular choice among drone engineers for its reliability, performance, and industry ecosystem support. UAVCHIP maintains stock of THGBMHG8C2LBAIL for rapid global fulfillment.

Key Features

  • Part Number: THGBMHG8C2LBAIL
  • Manufacturer: Kioxia (Toshiba)
  • Type: eMMC 5.1
  • Capacity: 16 GB
  • Bus Width: 8-bit
  • Bus Speed: HS400
UAV Applications
AI Drone OS
16GB Yocto/Ubuntu for AI drone missions
Mapping Drone
Store offline map tiles and flight logs
Vision Platform
ROS2 and deep learning model storage
Edge AI
16GB for model weights and inference cache
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